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Sony banks on ’revolution’ with new 3D and HD solutions

16 June 2010

Singapore - Reaffirming its commitment to state-of-the-art broadcast technologies, Sony Electronics Asia Pacific is showcasing its widest range of 3D and high-definition (HD) solutions at BroadcastAsia. In line with this year’s theme of ’Deliver Tomorrow’s Reality With Today’s Technology’, the company is addressing the industry’s need for transformation to keep up with the evolving digital landscape and demands from an increasingly discerning audience for high quality content.

"We believe there is a revolution going on from SD to HD," Chris Grey, head of broadcast and content creation solutions said at a press briefing on Tuesday. With price points for SD and HD TV sets almost levelling, Grey said the conversion to HD is "inevitable". Sony reports it has seen a massive growth in sales of HD-ready TV as the market leans toward large-screen viewing.

Sports and gaming were drivers for HD TV growth, and Grey predicts the same will be true for 3D TV, with sales of 3D TV sets seen hitting 28 million by 2010. Sony is already the official sponsor for the ESPN 3D network, and is also partnering with Discovery Communications and IMAX to develop the first 24/7 dedicated 3D television network in the US.

Banking on 3D being the next big entertainment platform, Sony is demonstrating its ability to offer services and solutions for every part of the 3D workflow from the "lens to the living room". Making their Asia debut are a number of latest technologies for 3D content creation such as the Sony MPE-200 multi-image processor, which detects, analyses and corrects various alignment errors which occur when using two cameras in a rig during 3D production. "It’s a cost-effective solution which takes away some of the mechanical adjustments from the rig," Paul Maroni, head of live production product marketing, said during a tour of Sony’s booth at BroadcastAsia.

Sony is also highlighting the HDFA-200 optical fiber transmission adapter, which enables the transmission of two HD-SDI signals with a single SMPTE camera fiber cable to a single CCU with 3G interface during 3D production.


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